China’s Ic Packaging And Testing Industry Chain Innovation Alliance Formed
To speed up the national science and technology major project “great scale integrated circuit manufacturing and equipment and complete process,” the organization to implement and explore innovative mechanisms to guide industrial development, “China’s IC packaging and testing industry chain Innovation Alliance” established in Beijing on the 30th. This is the major projects in 16 countries in science and technology establishment of the first Industrial Technology Innovation Alliance.
According to reports, the Alliance is engaged in IC testing and industrial chain manufacturing, development, research and teaching more than 20 units, will focus on “great scale integrated circuit manufacturing process equipment and complete sets of” major projects of innovation topics , joint field of IC testing industry chain relationship Key Technology research. Union will help China’s IC packaging and testing industry concentration and integration of new resources, speed up the IC packaging and testing industry’s core technology and key product development, application and industrialization, Promotion of Producing Technology Cooperation , The transformation and exchange of domestic and foreign scientific and technological innovation to improve China’s IC packaging and testing industry Innovation Capacity and the overall level of innovation.
Ministry party secretary Li Xueyong, Vice Minister Cao Jianlin attended the meeting.
Xueyong said in his speech, the party’s 17 National Congress to improve independent innovation capability and building an innovative country, as the core of national development strategies and improving comprehensive national strength of the key, put in promoting sound and rapid economic development in a prominent position . Strategic alliance to promote industrial technology innovation is to promote the construction of national innovation system is one of important strategic initiatives. In the construction process, should the basic building alliances on industry development and competitiveness upgrading, on the IC packaging and testing industry chain, a major breakthrough in the technology innovation, focuses on “great scale integrated circuit manufacturing equipment and complete sets of technology” major projects and key tasks identified. To insist on integration of integrated resources, study, and research, complementary building industrial technological innovation chain, the establishment of sustainable, stable relations of cooperation. To adhere to a legally binding contract for the protection, exploration and development of beneficial alliance to consolidate an effective mechanism. “IC testing industry chain innovation alliance” is a special implementation of major organizational innovation Combination of the first mode, also in major projects in industrial technology innovation and strategic alliances to promote the building of a good start. Should continue, according to the State Council established the principles and requirements for the implementation of major projects and national technology innovation project plans and stepping up the implementation of major projects, speed up technological innovation system, foster strategic emerging industries, for building an innovative country and make new effective contribution.
“Great scale integrated circuit manufacturing equipment and complete process,” the overall national science and technology major project team leader, director of Institute of Microelectronics sweet leaf spring introduced the progress in the implementation of the special. He said the main task of the special is now fully launched, focusing on the task in full swing, has completed 53 project, several tasks have been achieved initial results are expected by 2011, will drive the implementation of special equipment, materials, information and parts manufacturing related industries grew by 150 billion yuan. He said that since 2011 China’s IC industry will realize the scale of the initial development trend, the overall technological level of the gap with foreign countries on behalf of shortened from 4 to 2 generations, there will be 8-10 kinds of high-end equipment and key components integrated circuit products entered the market Pin Sales, initially supporting comprehensive ability and innovation ability, and gradually change the past by the lack of independent intellectual property rights Ershi development everywhere passive situation of subjection to grasp the development of the initiative. At the same time, will greatly promote China’s packaging automation Equipment manufacturing Level improved.
It is reported that Jiangsu Changjiang Electronics Technology Co., Ltd. and Nantong Fujitsu Microelectronics Co., Ltd. and other two domestic listed companies, and engaged in IC testing and industrial chain manufacturing, development, research and teaching of 25 core units as Alliance sponsors.
I am China Manufacturers writer, reports some information about airbrush nail designs , wholesale crayons.
Article from articlesbase.com
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